DESCRIPTION
The UPA822TF contains two NE681 NPN high frequency silicon bipolar chips. NECs new low profile TF package is ideal for all portable wireless applications where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications. 1

FEATURES
• SMALL PACKAGE OUTLINE:
   SOT-363 package measures just 2.0 mm x 1.25 mm
• LOW HEIGHT PROFILE:
   Just 0.60 mm high
• HIGH COLLECTOR CURRENT:
   IC MAX = 65 mA