UG6KB40 Hoja de datos - Burland Technology Solutions
Fabricante

Burland Technology Solutions
Features
• Glass passivated die construction
• Low forward voltage drop
• High current capability
• High surge current capability
• Designed for surface mount application
• Plastic material-UL flammability 94V-0
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request
Mechanical Data
• Case: D3K, Molded plastic
• Terminals: Plated leads solderable per MIL-STD-202,
Method 208
• Polarity: as marked on case
• Mounting Position: Any
• Lead Free: For RoHS / Lead Free Version