TSS0340L(V_A07) Hoja de datos - TSC Corporation
Fabricante

TSC Corporation
Features
✧ Designed for mounting on small surface
✧ Extremely thin/leadless package
✧ Low capacitance
✧ Low forward voltage drop
✧ High temperature soldering:
260°C/10 seconds at terminals
✧ Chip version in 1005
Mechanical Data
✧ Case: 1005 Standard package, molded plastic
✧ Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
✧ Polarity: Indicated by cathode band
✧ Mounting position: Any
✧ Package code: RW
✧ Weight: 0.006 gram (approximately)
Número de pieza
componentes Descripción
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