FEATURES
• Low profile package
• Ideal for automated placement
• Low forward voltage drop, low power losses
• High efficiency
• High surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
    For use in low voltage, high frequency inverters, freewheeling, dc-to-dc converters, and polarity protection applications.