
TSC Corporation
Features
✧ Very low profile - typical height of 0.68mm
✧ Ideal for automated placement
✧ Low forward voltage drop. Low power loss.
✧ High efficiency
✧ Meet MSL level 1, per J-STD-020D,
lead free maximum peak of 260℃
✧ Solder dip 265℃ max. 10 s, per JESD 22-A111
✧ Compliant to RoHS directive 2002/95/EC
and in accordance to WEEE 2002/96/EC
✧ Halogen-free according to IEC 61249-2-21
definition
Typical Application
✧ For use in low voltage high frequency inverter,
freewheeling, DC to DC converter, and polarity
protection applications.
Mechanical Data
✧ Case: Micro SMA
✧ Molding Compound meet UL 94V-0 flammability
rating.
✧ Terminals: Matte tin plated leads, solderable
per J-STD-002B, and JESD22-B102D.
✧ Polarity: Indicated by Cathode Band
✧ Packaging: 8 mm tape per EIA Std RS-481
✧ Weight: 0.006 gram