
Silicon Microstructures, Inc.
DESCRIPTION
The Silicon Microstructures SM6250 Series of MEMS pressure sensors combines state-of-the-art pressure sensor technology with CMOS mixed-signal processing technology in a dual ported SOIC-16 package.
Combining the pressure sensor with a signal conditioning ASIC in a single package simplifies the use of advanced silicon micromachined pressure sensors. The pressure sensor can be mounted directly to a standard printed circuit board (PCB). Pressure is measured from the backside, while additional protection to the electronic circuitry is provided by protective gel on the topside. The SM6250 is shipped uncalibrated and uncompensated with only a functional test.
FEATURES
• -50 to +50 mbar
• 10x burst pressure
• Amplified analog output
• 2.7 V to 5.5 V operation
• SOIC-16 Package
• -40oC to 85oC operating temperature range