FEATURES
✦ Batch process design, excellent power dissipation offers
   Better reverse leakage current and thermal resistance.
✦ Low profile surface mounted application in order to
   optimize board space.
✦ Low power loss, high efficiency.
✦ High current capability, low forward voltage drop.
✦ High surge capability.
✦ Guardring for overvoltage protection.
✦ Very tiny plastic SMD package.
✦ Ultra high-speed switching.
✦ Silicon epitaxial planar chip, metal silicon junction.
✦ Lead-free parts meet environmental standards of
   MIL-STD-19500/228

PACKAGING INFORMATION
✦ Epoxy: UL94-V0 rated flame retardant
✦ Case: Molded plastic, SOD323N
✦ Terminals: Plated terminals,
   solderable per MIL-STD-750, method 2026.
✦ Polarity: Indicated by cathode band
✦ Weight : 0.008 gram