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Fabricante
TSC Corporation
Features
◇ For surface mounted application
◇ Glass passivated junction chip.
◇ Low forward voltage drop
◇ High current capability
◇ Easy pick and place
◇ High surge current capability
◇ Plastic material used carries Underwriters Laboratory Classification 94V-0
◇ High temperature soldering: 260℃ /10 seconds at terminals
◇ Green compound with suffix "G" on packing code & prefix "G" on datecode.
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