FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Fast switching for high efficiency
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
   peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   For use in fast switching rectification of power supply,
   inverters, converters, and freewheeling diodes for
   consumer, automotive and telecommunication.