
Integrated Silicon Solution
GENERAL DESCRIPTION
The IS25LP032D and IS25WP032D Serial Flash memory offers a versatile storage solution with high flexibility and performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” Flash is for systems that require limited space, a low pin count, and low power consumption. The device is accessed through a 4-wire SPI Interface consisting of a Serial Data Input (SI), Serial Data Output (SO), Serial Clock (SCK), and Chip Enable (CE#) pins, which can also be configured to serve as multi-I/O (see pin descriptions).
FEATURES
• Industry Standard Serial Interface
- IS25LP032D: 32Mbit/4Mbyte
- IS25WP032D: 32Mbit/4Mbyte
- 256 bytes per Programmable Page
- Supports standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
- Supports Serial Flash Discoverable
Parameters (SFDP)
• High Performance Serial Flash (SPI)
- 50MHz Normal and 133Mhz Fast Read
- 532 MHz equivalent QPI
- DTR (Dual Transfer Rate) up to 66MHz
- Selectable Dummy Cycles
- Configurable Drive Strength
- Supports SPI Modes 0 and 3
- More than 100,000 Erase/Program Cycles
- More than 20-year Data Retention
• Flexible & Efficient Memory Architecture
- Chip Erase with Uniform: Sector/Block
Erase (4/32/64 Kbyte)
- Program 1 to 256 Bytes per Page
- Program/Erase Suspend & Resume
• Efficient Read and Program modes
- Low Instruction Overhead Operations
- Continuous Read 8/16/32/64-Byte
Burst Wrap
- Selectable Burst Length
- QPI for Reduced Instruction Overhead
- AutoBoot Operation
• Low Power with Wide Temp. Ranges
- Single Voltage Supply
IS25LP: 2.30V to 3.60V
IS25WP: 1.65V to 1.95V
- 4 mA Active Read Current (typ.)
- 10 µA Standby Current (typ.)
- 1 µA Deep Power Down (typ.)
- Temp Grades:
Extended: -40°C to +105°C
Auto Grade (A3): -40°C to +125°C
• Advanced Security Protection
- Software and Hardware Write Protection
- Power Supply Lock Protect
- 4x256-Byte Dedicated Security Area
with OTP User-lockable Bits
- 128 bit Unique ID for Each Device
(Call Factory)
• Industry Standard Pin-out & Packages(1)
- B = 8-pin SOIC 208mil
- N = 8-pin SOIC 150mil
- T = 8-contact USON 4x3mm
- E = 8-contact XSON 4x4mm
- K = 8-contact WSON 6x5mm
- L = 8-contact WSON 8x6mm(Call Factory)
- M = 16-pin SOIC 300mil
- G= 24-ball TFBGA 4x6 ARRAY
- H = 24-ball TFBGA 5x5 ARRAY
- KGD (Call Factory)