DESCRIPTION
Third generation power MOSFETs from Vishay provide the designer with the best combinations of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The D2PAK is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power capability and the last lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through-hole version (SiHF640L) is available for low-profile applications.

FEATURES
• Surface mount
• Low-profile through-hole
• Available in tape and reel
• Dynamic dV/dt rating
• 150 °C operating temperature
• Fast switching
• Fully avalanche rated
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912