GBPC25005 Hoja de datos - Naina Semiconductor ltd.
Fabricante

Naina Semiconductor ltd.
Features
• Glass passivated chip junction
• Low reverse leakage current
• High surge current capability
• Low power loss
• High efficiency
• Electrically isolated metal case for
maximum heat dissipation
Mechanical Data
• Case: Molded plastic body with heatsink
• Terminals: Plated lead Solderable (Add “W” suffix for Wire Leads)
• Polarity: As marked on Case
• Mounting: Through hole for #10 Screw
• Mounting Torque: 20 in-lbs max.
• Weight: 18 grams (approx)