Número de pieza
CP792V
componentes Descripción
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Central Semiconductor
CP792V Hoja de datos - Central Semiconductor
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL PLANAR
Die Size 11 x 11 MILS
Die Thickness 7.0 MILS
Base Bonding Pad Area 3.7 x 3.7 MILS
Emitter Bonding Pad Area 3.7 x 3.7 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au - 18,000Å
Número de pieza
componentes Descripción
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Fabricante
Small Signal Transistor PNP - Amp/Switch Transistor Chip ( Rev : 2006 )
Central Semiconductor
Small Signal Transistors PNP - Amp/Switch Transistor Chip ( Rev : 2006 )
Central Semiconductor
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