Número de pieza
BYV27-150
componentes Descripción
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page
16 Pages
File Size
106.6 kB
Fabricante
Philips Electronics
BYV27-150 Hoja de datos - Philips Electronics
Philips Electronics
DESCRIPTION
Rugged glass SOD57 package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.
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