Número de pieza
BYV1100
componentes Descripción
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no available.
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page
12 Pages
File Size
64.4 kB
Fabricante
Philips Electronics
BYV1100 Hoja de datos - Philips Electronics
Philips Electronics
DESCRIPTION
Cavity free cylindrical glass package through Implotec(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.
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