Número de pieza
BYG85B
componentes Descripción
Other PDF
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page
12 Pages
File Size
66.7 kB
Fabricante
Philips Electronics
BYG85B Hoja de datos - Philips Electronics
Philips Electronics
DESCRIPTION
DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape.
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