Número de pieza
BYD57G
componentes Descripción
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PDF
page
12 Pages
File Size
77.2 kB
Fabricante
Philips Electronics
BYD57G Hoja de datos - Philips Electronics
Philips Electronics
DESCRIPTION
Cavity free cylindrical glass SOD87 package through Implotec™(1) technology. The SOD87 is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
(1) Implotec is a trademark of Philips.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Shipped in 8 mm embossed tape
• Smallest surface mount rectifier outline.
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