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BYD17M Hoja de datos - Philips Electronics

BYD17 image

Número de pieza
BYD17M

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page
8 Pages

File Size
53.8 kB

Fabricante
Philips
Philips Electronics 

DESCRIPTION
Cavity free cylindrical glass package through Implotec(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
   
FEATURES
• Glass passivated
• High maximum operating
    temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
    absorption capability
• Shipped in 8 mm embossed tape
• Smallest surface mount rectifier
    outline.
   

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