Número de pieza
BY228
componentes Descripción
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General Semiconductor
BY228 Hoja de datos - General Semiconductor
General Semiconductor
FEATURES
♦ High temperature metallurgically bonded construction
♦ Glass passivated cavity-free junction
♦ 2.5 ampere operation at TA=50°C with no thermal runaway
♦ Typical IR less than 0.1µA
♦ Hermetically sealed package
♦ Capable of meeting environmental standards of MIL-S-19500
♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
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