FEATURES
• UL recognition file number E312394
• Thin single in-line package
• Glass passivated chip junction
• Available for BU-5S lead forming option
   (part number with “5S” suffix, e.g. BU20065S)
• Superior thermal conductivity
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
   General purpose use in AC/DC bridge full wave rectification
   for switching power supply, home appliances and
   white-goods applications.