Número de pieza
BF3506TV
componentes Descripción
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PDF
page
3 Pages
File Size
51.5 kB
Fabricante

STMicroelectronics
DESCRIPTION
The Bridges series from SGS-THOMSON has been designed to allow a better standardization of packages on boards principally designed with ISOTOP packages. The insulated package of the bridge will be able to sit on heatsink with other components. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advantage in these industry package products.
FEATURES AND BENEFITS
■ COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES, TRANSISTORS AND PASSIVE COMPONENTS.
■ EXCELLENT THERMAL TRANSFER JUNCTION TI HEATSINK
■ UL PENDING