FEATURES
- Fast switching device(trr<50ns)
- Surface mount device type
- Moisture sensitivity level 1
- Low reverse leakage
- Pb free and RoHS compliant
- Green compound (Halogen free) with suffix "G" on
   packing code and prefix "G" on date code

MECHANICAL DATA
- Case: Bend lead SOD-123 small outline plastic package
- Terminal: Matte tin plated, lead free, solderable
   per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260°C/10s
- Polarity: Indicated by cathode band
- Weight: 10.5 ± 0.5 mg