FEATURES
- Epitaxial planar die construction
- Surface Mount Device Type
- Moisture sensitivity level 1
- For high voltage switcing and amplifier application
- Pb free and RoHS compliant
- Green compound (Halogen free) with suffix "G" on
   packing code and prefix "G" on date code
- Excellent hFE linearity
- Complements the 2SC5658

MECHANICAL DATA
- Case: SOT-723 small outline plastic package
- Terminal: Matte tin plated, lead free, solderable
   per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260°C/10s
- Weight: 1.27mg +/- 20%