Número de pieza
1N5196
componentes Descripción
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Fabricante
Microsemi Corporation
1N5196(V3) Hoja de datos - Microsemi Corporation
Microsemi Corporation
GENERAL PURPOSE SILICON DIODES
FEATURES
● Voidless hermetically sealed glass package (DO-35).
● Triple layer passivation.
● Metallurgically bonded.
● TX types available per MIL-S-19500/118C.
● 1N5194 thru 1N5196 only available in surface mount.
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