SMD Type
MOSFET
P-Channel Enhancement MOSFET
SI2333CDS (KI2333CDS)
■ Electrical Characteristics Ta = 25℃
Parameter
Symbol
Drain-Source Breakdown Voltage
VDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body leakage current
Gate Threshold Voltage
IGSS
VGS(th)
Static Drain-Source On-Resistance *1
RDS(On)
On state drain current *1
Forward Transconductance *1
Gate Resistance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
ID(ON)
gFS
Rg
Ciss
Coss
Crss
Qg
Test Conditions
ID=-250μA, VGS=0V
VDS=-12V, VGS=0V
VDS=-12V, VGS=0V, TJ=55℃
VDS=0V, VGS=±8V
VDS=VGS ID=-250μA
VGS=-4.5V, ID=-5.1A
VGS=-2.5V, ID=-4.5A
VGS=-1.8V, ID=-2.0A
VGS=-4.5V, VDS=-5V
VDS=-5V, ID=-1.9A
f=1.0MHz
VGS=0V, VDS=-6V, f=1MHz
VGS=-4.5V, VDS=-6V, ID=-5.1A
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
Body Diode Reverse Recovery Charge
Body Diode Reverse Recovery Time
Reverse Recovery Fall Time
Reverse Recovery Rise Time
Maximum Body-Diode Continuous Current
Pulse Diode Forward Current *1
Diode Forward Voltage
Qgs
Qgd
td(on)
tr
td(off)
tf
Qrr
trr
ta
tb
IS
ISM
VSD
VGS=-2.5V, VDS=-6V, ID=-5.1A
VGS=-4.5V, VDS=-6V, RL=6Ω,RGEN=1Ω
ID=-1.0A
IF = 1.0 A, di/dt = 100 A/ us,TJ=25℃
TC=25℃
IS=-1.0A,VGS=0V
Min Typ Max Unit
-12
V
-1
μA
-10
±100 nA
-0.4
-1
V
28. 5 35
36 45 mΩ
46 59
-20
A
1.6
S
4.0
Ω
1225
315
pF
260
15 25
9 15
nC
1.9
3.8
13 20
35 60
ns
45 70
12 20
20 40 nC
32 50
16
ns
16
-1.0
A
-20
-0.7 -1.2 V
*1Pulse test: PW ≤ 300us duty cycle ≤ 2%.
■ Marking
Marking
O3*
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