DTC143ZM3T5G(2012) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
fabricante
DTC143ZM3T5G Datasheet PDF : 12 Pages
| |||
MUN2233, MMUN2233L, MUN5233, DTC143ZE, DTC143ZM3, NSBC143ZF3
PACKAGE DIMENSIONS
b 3 PL
0.20 (0.008) M D
−E−
2
3
1
C
L
SC−75/SOT−416
CASE 463
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
e −D−
HE
0.20 (0.008) E
A
A1
SOLDERING FOOTPRINT*
0.356
0.014
MILLIMETERS
DIM MIN NOM MAX
A 0.70 0.80 0.90
A1 0.00 0.05 0.10
b 0.15 0.20 0.30
C 0.10 0.15 0.25
D 1.55 1.60 1.65
E 0.70 0.80 0.90
e
1.00 BSC
L 0.10 0.15 0.20
HE 1.50 1.60 1.70
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
INCHES
MIN NOM MAX
0.027 0.031 0.035
0.000 0.002 0.004
0.006 0.008 0.012
0.004 0.006 0.010
0.059 0.063 0.067
0.027 0.031 0.035
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
ǒ mm Ǔ
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10
Share Link: 