NCP161
PACKAGE DIMENSIONS
PIN A1
REFERENCE
2X
0.05 C
D
È
AB
E
WLCSP4, 0.64x0.64
CASE 567KA
ISSUE O
2X
0.05 C TOP VIEW
A2
0.05 C
A
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.35 0.45
A1 0.14 0.18
A2
0.25 REF
b 0.185 0.215
D
0.64 BSC
E
0.64 BSC
e
0.35 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
4X b
0.05 C A B
B
0.03 C
A
e
e
12
BOTTOM VIEW
0.35
PITCH
4X
0.20
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
17