Absolute Maximum Ratings
Items
Symbol
Value
Unit
Power Dissipation at Tamb=25℃
Junction Temperature
Storage Temperature Range
PTOT
500 *
mW
TJ
175
℃
TSTG
-65 ~ +175
℃
* Valid provided that leads at a distance of 10mm from case are kept at ambient temperature
Characteristic at Tamb=25℃
Items
Symbol Min.
Typ.
Max.
Unit
Thermal Resistance Junctiobn to Ambient Air
RθJA
-
-
0.3 * K / mW
Forward Voltage @ IF=200mA
VF
-
-
1.0
V
* Valid provided that leads at a distance of 10mm from case are kept at ambient temperature
mA
50
IZ 40
30
20
10
0
Breakdown Characteristics
5
10
15
20
Test currrent
Iz=5mA
ZMM55 Series
25
30V
VZ
Change in the power dissipation
due to the ambient temperature.
500
400
300
200
100
50 100 150 200 250
Ta (℃)
Ambient Temperature.
Mechanical Data
Items
Materials
Package
Mini MELF
Case
Hermeticall sealed glass
Lead Finish
Solder Plating
Packaging Dimensions (mm)
Symbol
Min
Max
A
3.302
3.505
B
1.397
1.499
C
0.350
0.500
MINI MELF
B
A
C
Dimensions in mm
http://www.SeCoSGmbH.com/
21-Aug-2007 Rev.B
Any changing of specification will not be informed individual
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