
PACKAGE OUTLINE (WL-CSP)
All dimensions in microns
1670 ± 5
BOTTOM VIEW
1420 ± 5
220 ± 10
210 ± 5
500 ± 5
DA9160.004
13 March 2003
BACKSIDE MARKING
(ON-CHIP TEXT )
335 ± 5
VOUT2 (PIN A1) DESIGNATOR
100–150 Coplanarity across chipsite (die) ≤ 10
480 ± 25
Definitions:
YYWW = Year and week
XXX = MAS lot number last three numbers
ZZ = Wafer number
11 (15)