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componentes Descripción

fabricante

CS5132HGDWR24

Dual Output CPU Buck Controller

ON Semiconductor 

Package Specification

PACKAGE DIMENSIONS IN mm (INCHES)

PACKAGE THERMAL DATA

Lead Count

24L SO Wide

Metric

Max Min

15.60 15.20

D

English

Max Min

.614 .598

Thermal Data

RΘJC

typ

RΘJA

typ

24L SO Wide

16

80

°C/W

°C/W

Surface Mount Wide Body (DW); 300 mil wide

7.60 (.299)

7.40 (.291)

10.65 (.419)

10.00 (.394)

0.51 (.020)

0.33 (.013)

2.49 (.098)

2.24 (.088)

1.27 (.050) 0.32 (.013)

0.40 (.016) 0.23 (.009)

D

REF: JEDEC MS-013

1.27 (.050) BSC

2.65 (.104)

2.35 (.093)

0.30 (.012)

0.10 (.004)

Ordering Information

Part Number

CS5132HGDW24

CS5132HGDWR24

Description

24L SO Wide

24L SO Wide (tape & reel)

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mation and the latest available information, please contact

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© Semiconductor Components Industries, LLC, 2000

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