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T1205 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
fabricante
T1205 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
BTA12, BTB12, T1205, T1210, T1235, T1250
Characteristics (curves)
Figure 9. Relative variation of critical rate of decrease of Figure 10. Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
main current versus (dV/dt)c (typical values)(TW)
(dI/dt )c [(d V/dt )c] / specified (dI/dt )c
2.8
2.4
2.0
C
1.6 B
1.2
T1210/SW
T1235/T1250/CW/BW
0.8
0.4
0.0
0.1
(dV/dt)c(V/µs)
1 .0
10.0
100.0
(dI/dt )c [(d V/dt )c] / specified (dI/dt )c
5.0
4.5
4.0
TW, T1205
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
(dV/dt)c(V/µs)
1.0
10.0
100.0
Figure 11. Relative variation of critical rate of decrease of Figure 12. D2PAK thermal resistance junction to ambient
main current versus junction temperature
versus copper surface under tab
(dl/dt)c [Tj] / (dl/dt)c [Tj specified]
6
5
4
3
2
1
Tj(°C)
0
0
25
50
75
1 00
125
80 Rth(j-a) (°C/W)
70
60
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
50
40
30
20
10
0
0
SCu(cm²)
5
10
15
20
25
30
35
40
DS2115 - Rev 12
page 6/16

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