CXP5078 Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

fabricante

CXP5078

CMOS 4-bit Single Chip Microcomputer

Sony Semiconductor 

Package Outline

Unit: mm

80PIN QFP (PLASTIC)

64

65

23.9 ± 0.4

+ 0.4

20.0 – 0.1

41

40

CXP5076/5078

+ 0.1

0.15 – 0.05

0.15

80

1

0.8

25

0.12 M

24

+ 0.15

0.35 – 0.1

+ 0.35

2.75 – 0.15

A

+ 0.2

0.1 – 0.05

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-80P-L01

QFP080-P-1420

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42/COPPER ALLOY

PACKAGE MASS

1.6g

– 18 –

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