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PA16A

POWER OPERATIONAL AMPLIFIERS

Apex Microtechnology

PA16A Datasheet PDF : 4 Pages

1 2 3 4

PA16 • PA16A

OPERATING

CONSIDERATIONS

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GENERAL

Please read Application Note 1 "General Operating Considerations" which cov-

ers stability, supplies, heat sinking, mounting, current limit, SOA interpretation, and

speciﬁcation interpretation. Visit www.apexmicrotech.com for design tools that help

automate tasks such as calculations for stability, internal power dissipation, current

limit; heat sink selection; Apex’s complete Application Notes library; Technical Seminar

Workbook; and Evaluation Kits.

SAFE OPERATING AREA

(SOA)

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The SOA curves combine ��

the effect of all limits for this

Power Op Amp. For a given

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application, the direction

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and magnitude of the output ��

current should be calculated

or measured and checked ��

against the SOA curves.

This is simple for resistive

loads but more complex for ��

reactive and EMF generat- ��

ing loads. The following

guidelines may save exten-

sive analytical efforts:

The ampliﬁer can handle

any EMF generating or

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reactive load and short cir-

cuits to the supply rails or shorts to common if the current limits are set as follows at

TC = 85°C.

SHORT TO ±VS

SHORT TO

±VS

C, L OR EMF LOAD

COMMON

18V

.9A

1.8A

15V

1.0A

2.1A

10V

1.6A

3.2A

These simpliﬁed limits may be exceeded with further analysis using the operating

conditions for a speciﬁc application.

CURRENT LIMIT

Proper operation requires the use of two current limit resistors, connected as shown

in the external connection diagram. The minimum value for RCL is 0.12 ohm, however for

optimum reliability it should be set as high as possible. Refer to the “General Operating

Considerations” section of the handbook for current limit adjust details.

RCL =

.65

-0.01

ILIM (A)

DEVICE MOUNTING

The case (mounting ﬂange) is electrically isolated and should be mounted directly to a

heatsink with thermal compound. Screws with Belville spring washers are recommended

to maintain positive clamping pressure on heatsink mounting surfaces. Long periods

of thermal cycling can loosen mounting screws and increase thermal resistance.

Since the case is electrically isolated (ﬂoating) with respect to the internal circuits it

is recommended to connect it to common or other convenient AC ground potential.

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