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BYG22A, BYG22B, BYG22D
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL BYG22A
Maximum instantaneous
forward voltage
Maximum reverse current
Maximum reverse recovery time
IF = 1.0 A
IF = 2.0 A
TJ = 25 °C
VR = VRRM
TJ = 25 °C
TJ = 100 °C
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
VF (1)
IR
trr
Note
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
BYG22B
1.0
1.1
1
10
25
BYG22D
UNIT
V
µA
ns
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL BYG22A
Maximum thermal resistance, junction to lead, TL = const.
Maximum thermal resistance, junction to ambient
RJL
RJA (1)
RJA (2)
RJA (3)
Notes
(1) Mounted on epoxy-glass hard tissue
(2) Mounted on epoxy-glass hard tissue, 50 mm2 35 μm Cu
(3) Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 μm Cu
BYG22B
25
150
125
100
BYG22D
UNIT
°C/W
°C/W
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE
BYG22A-E3/TR
0.064
TR
BYG22A-E3/TR3
0.064
TR3
BYG22AHE3/TR (1)
0.064
TR
BYG22AHE3/TR3 (1)
0.064
TR3
Note
(1) AEC-Q101 qualified
BASE QUANTITY
1800
7500
1800
7500
DELIVERY MODE
7" diameter plastic tape and reel
13" diameter plastic tape and reel
7" diameter plastic tape and reel
13" diameter plastic tape and reel
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
10
1
TJ = 150 °C
TJ = 25 °C
0.1
0.01
0.001
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Forward Voltage (V)
Fig. 1 - Forward Current vs. Forward Voltage
2.5
2.0
RθJA ≤ 25 K/W
1.5
1.0
RθJA ≤ 125 K/W
0.5
RθJA ≤ 150 K/W
VR = VRRM
Half Sine-Wave
0
0 20 40 60 80 100 120 140 160
Ambient Temperature (°C)
Fig. 2 - Max. Average Forward Current vs. Ambient Temperature
Revision: 30-Oct-13
2
Document Number: 88959
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