TH3044_01 Ver la hoja de datos (PDF) - Melexis Microelectronic Systems
Número de pieza
componentes Descripción
fabricante
TH3044_01 Datasheet PDF : 10 Pages
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Mechanical Specifications
SOIC8 and SOIC14B Package Dimensions
TH3044
K-Bus Interface
EH
123
D
A1 A
α
e
b
L
Small Outline Integrated Circiut (SOIC),
All Dimension in mm, coplanarity < 0.1 mm
D
E
H
A
A1
e
b
L
α
SOIC 8
min
150 mil
max
4.8
3.80 10.00 5.80 0.10
0.33 0.40
0°
1.27
5.0
4.00 10.65 6.20 0.25
0.51 1.27
8°
SOIC 14 min
150 mil
max
8.55 3.80 5.80 1.35 0.10
0.33 0.40
0°
1.27
8.75 4.00 6.20 1.75 0.25
0.51 1.27
8°
All Dimension in inch, coplanarity < 0.004”
SOIC 8
min
150 mil
max
0.189 0.150 0.228 0.053 0.004
0.013 0.016
0°
0.050
0.197 0.157 0.244 0.069 0.010
0.020 0.050
8°
SOIC 14 min
150 mil
max
0.337 0.150 0.228 0.053 0.004
0.013 0.016
0°
0.050
0.334 0.157 0.224 0.069 0.010
0.020 0.050
8°
Datasheet Rev 1.1 July 2001
Page 9
www.melexis.com
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