NXP Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
inches
0.19
0.02
0.15
0.055 0.021 0.013
0.045 0.015 0.009
0.86
0.84
0.26
0.24
0.1
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
e1
7.62
0.3
L
3.9
3.4
0.15
0.13
ME
8.25
7.80
0.32
0.31
MH
w
Z (1)
max.
9.5
8.3
0.254
2.2
0.37
0.33
0.01 0.087
OUTLINE
VERSION
SOT38-1
IEC
050G09
REFERENCES
JEDEC
JEITA
MO-001
SC-503-16
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 10. Package outline SOT38-1 (DIP16)
74HC_HCT4040
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 20 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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