SY89464UMGTR Ver la hoja de datos (PDF) - Micrel
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SY89464UMGTR Datasheet PDF : 19 Pages
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Micrel, Inc.
Absolute Maximum Ratings(1)
Supply Voltage (VCC) ............................ –0.5V to +4.0V
Input Voltage (VIN) ....................................–0.5V to VCC
LVPECL Output Current (IOUT) ......................................
Continuous .................................................... 50mA
Surge ........................................................... 100mA
Input Current (IIN) ...........................................................
IN, /IN........................................................... ±50mA
VT ............................................................... ±100mA
VREF-AC Current
Source/Sink Current on VREF-AC.................... ±2mA
Lead Temperature (soldering, 20 sec.)............ +260°C
Storage Temperature (Ts) ...................–65°C to 150°C
SY89464U
Operating Ratings(2)
Supply Voltage (VCC) ....................+2.375V to +2.625V
........................................................ +3.0V to +3.6V
APmacbkiaegnet TTehmerpmeraal tRureesi(sTtaA)n.c..e..(.3.)........... –40°C to +85°C
MLF™ (θ JA)
Still-Air ..................................................... 24.4°C/W
MLF™ (ψ JB)
Junction-to-Board ..................................... 8.1°C/W
DC Electrical Characteristics(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
2.5
2.625
V
3.0
3.3
3.6
V
ICC
RIN
RDIFF_IN
Power Supply Current
Input Resistance
(IN-to-VT)
Differential Input Resistance
(IN-to-/IN)
No load, max VCC
120
160
mA
45
50
55
Ω
90
100
110
Ω
VIH
Input High Voltage
(IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a. Note 5.
0.1
2.5
V
VDIFF_IN Differential Input Voltage Swing See Figure 1b.
0.2
V
|IN-/IN|
VIN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
VT_IN
IN-to-VT
(IN, /IN)
1.28
V
VREF-AC Output Reference Voltage
VCC–1.3 VCC–1.2 VCC–1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θJA and
ψJB values are determined for a 4-layer board in still air unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VIN (max) is specified when VT is floating.
December 2005
5
M9999-120105-B
hbwhelp@micrel.com or (408) 955-1690
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