AD9135BCPZ Ver la hoja de datos (PDF) - Analog Devices
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AD9135BCPZ Datasheet PDF : 117 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 10.
Parameter
I120 to Ground
SERDINx±, VTT, SYNCOUT1±/
SYNCOUT0±, TXENx
OUTx±
SYSREF±
CLK± to Ground
RESET, IRQ, CS, SCLK, SDIO,
SDO to Ground
LDO_BYP1
LDO_BYP2
LDO24
Ambient Operating Temperature (TA)
Operating Junction Temperature
Storage Temperature Range
Rating
−0.3 V to AVDD33 + 0.3 V
−0.3 V to SIOVDD33 + 0.3 V
−0.3 V to AVDD33 + 0.3 V
GND − 0.5 V to +2.5 V
−0.3 V to PVDD12 + 0.3 V
−0.3 V to IOVDD + 0.3 V
−0.3 V to SVDD12 + 0.3 V
−0.3 V to PVDD12 + 0.3 V
−0.3 V to AVDD33 + 0.3 V
−40°C to +85°C
125°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
AD9135/AD9136
THERMAL RESISTANCE
The exposed pad (EPAD) must be soldered to the ground plane
for the 88-lead LFCSP. The EPAD provides an electrical, thermal,
and mechanical connection to the board.
Typical θJA, θJB, and θJC values are specified for a 4-layer
JESD51-7 high effective thermal conductivity test board for
leaded surface-mount packages. θJA is obtained in still air
conditions (JESD51-2). Airflow increases heat dissipation,
effectively reducing θJA. θJB is obtained following double-ring
cold plate test conditions (JESD51-8). θJC is obtained with the test
case temperature monitored at the bottom of the exposed pad.
ΨJT and ΨJB are thermal characteristic parameters obtained with
θJA in still air test conditions.
Junction temperature (TJ) can be estimated using the following
equations:
TJ = TT + (ΨJT × P)
or
TJ = TB + (ΨJB × P)
where:
TT is the temperature measured at the top of the package.
P is the total device power dissipation.
TB is the temperature measured at the board.
Table 11. Thermal Resistance
Package
θJA
θJB
θJC
ΨJT ΨJB Unit
88-Lead LFCSP1 22.6 5.59 1.17 0.1 5.22 °C/W
1 The exposed pad must be securely connected to the ground plane.
ESD CAUTION
Rev. C | Page 11 of 117
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