B32921C/D ... B32928C/D
X2 / 305 V AC
Body temperature should follow the description below:
MKP capacitor
During pre-heating: Tp ≤ 110 °C
During soldering: Ts ≤ 120 °C, ts ≤ 45 s
MKT capacitor
During pre-heating: Tp ≤ 125 °C
During soldering: Ts ≤ 160 °C, ts ≤ 45 s
When SMD components are used together with leaded ones, the film capacitors should not pass
into the SMD adhesive curing oven. The leaded components should be assembled after the SMD
curing step.
Leaded film capacitors are not suitable for reflow soldering.
In order to ensure proper conditions for manual or selective soldering, the body temperature of
the capacitor (Ts) must be ≤ 120 °C.
One recommended condition for manual soldering is that the tip of the soldering iron should
be < 360 °C and the soldering contact time should be no longer than 3 seconds.
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please refer to EPCOS Film Capacitor Data Book in case more details are needed.
Please read Cautions and warnings and
Important notes at the end of this document.
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