WE128K32N-150H1Q Ver la hoja de datos (PDF) - White Electronic Designs Corporation
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WE128K32N-150H1Q Datasheet PDF : 14 Pages
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White Electronic Designs
WE128K32-XXX
FIGURE 12 – ALTERNATE PIN CONFIGURATION FOR WE128K32NP-XH1X
Top View
1
12
23
34
45
56
I/O8
WE2# I/O15
I/O24
VCC
I/O31
I/O9
CS2#
I/O14
I/O25 CS4#
I/O30
I/O10
GND
I/O13
I/O26 WE4#
I/O29
A14
I/O11
I/O12
A7
I/O27
I/O28
A16
A10
OE#
A12
A4
A1
A11
A9
NC
NC
A5
A2
A0
A15
WE1#
A13
A5
A3
NC
VCC
I/O7
A8 WE3#
I/O23
I/O0
CS1# I/O6
I/O16 CS3#
I/O22
I/O1
NC
I/O5
I/O17 GND
I/O21
I/O2
I/O3
I/O4
11
22
33
I/O18
I/O19
I/O20
44
55
66
Pin Description
I/O0-31
A0-16
WE1-4#
CS1-4#
OE#
VCC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
OE#
A0-16
WE1# CS1#
WE2# CS2#
WE3# CS3#
WE4# CS4#
128K x 8
128K x 8
128K x 8
128K x 8
8
I/O0-7
8
I/O8-15
8
I/O16-23
8
I/O24-31
ORDERING INFORMATION
W E 128K32 X - XXX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = Compliant
M = Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400*)
G2T = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pins 8, 21, 28, and 39 in HIP for upgrade
P = Alternate Pin Configuration for HIP package
ORGANIZATION 128K x 32
User Configurable as 256K x 16 or 512K x 8
EEPROM
WHITE ELECTRONIC DESIGNS CORP.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 10
13
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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