S70FL256P0XMFI201 Ver la hoja de datos (PDF) - Cypress Semiconductor
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S70FL256P0XMFI201 Datasheet PDF : 16 Pages
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11.2 ZSA024 — 24-ball Ball Grid Array (6 8 mm) Package
S70FL256P
PACKAGE
JEDEC
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
Øb
eE
eD
SD / SE
Design
for New ZSA024
N/A
8.00 mm x 6.00 mm
d PACKAGE
MIN
NOM
MAX
e ---
---
1.20
d 0.20
---
---
0.70
---
0.90
n 8.00 BSC.
e 6.00 BSC.
4.00 BSC.
m 4.00 BSC.
5
m 5
24
o 0.35
0.40
0.45
c 1.00 BSC.
1.00 BSC
e 0.00
Not R A1
NOTE
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3645 16-038.86 Rev A \ 02.26.10
Document Number: 002-00647 Rev. *F
Page 13 of 16
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