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SH8K1 Ver la hoja de datos (PDF) - ROHM Semiconductor

Número de pieza
componentes Descripción
fabricante
SH8K1
ROHM
ROHM Semiconductor 
SH8K1 Datasheet PDF : 4 Pages
1 2 3 4
SH8K1
Electrical characteristics (Ta=25C)
<It is the same characteristics for the Tr1 and Tr2.>
Parameter
Symbol Min. Typ. Max. Unit
Conditions
Gate-source leakage
IGSS
− ±10 μA VGS20V, VDS=0V
Drain-source breakdown voltage V(BR) DSS 30
Zero gate voltage drain current IDSS
V ID=1mA, VGS=0V
1
μA VDS=30V, VGS=0V
Gate threshold voltage
VGS (th) 1.0
2.5
V VDS=10V, ID=1mA
Static drain-source on-state
resistance
RDS
(on)
36 51
ID=5.0A, VGS=10V
52 73 mΩ ID=5.0A, VGS=4.5V
58 82
ID=5.0A, VGS=4V
Forward transfer admittance
Yfs 3.0
S ID=5.0A, VDS=10V
Input capacitance
Ciss
230
pF VDS=10V
Output capacitance
Coss
80
pF VGS=0V
Reverse transfer capacitance Crss
Turn-on delay time
td (on)
Rise time
tr
Turn-off delay time
td (off)
Fall time
tf
Total gate charge
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
Pulsed
50 pF f=1MHz
6
ns ID=2.5A, VDD 15V
8
ns VGS=10V
22
ns RL=6Ω
5
ns RG =10Ω
3.9 5.5 nC VDD 15V
1.1 nC VGS=5V
1.4 nC ID=5.0A
Body diode characteristics (Source-Drain) (Ta=25C)
<It is the same characteristics for the Tr1 and Tr2.>
Parameter
Forward voltage
Pulsed
Symbol Min. Typ. Max. Unit
Conditions
VSD
1.2
V IS=6.4A, VGS=0V
Data Sheet
www.rohm.com
2/3
c 2009 ROHM Co., Ltd. All rights reserved.
2009.12 - Rev.A

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