5962-89570 Ver la hoja de datos (PDF) - Avago Technologies
Número de pieza
componentes Descripción
fabricante
5962-89570 Datasheet PDF : 12 Pages
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Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
20 Pad LCCC
Surface Mount
2 Channels
1
VCC 8
2
VE 7
3
6
VO
4
GND 5
1
VCC 8
VO1
2
7
VO2
3
6
4
GND 5
15
VCC2
19
VO2
13
20
GND2 12
2
VO1 VCC1 10
3
GND1
78
Note:
All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground
connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
1.78 (0.070)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
0.64
(0.025)
(20 PLCS)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
Note: Dimensions in millimeters (inches).
Solder thickness 0.127 (0.005) max.
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
2.29 (0.090)
2.79 (0.110)
3
0.51 (0.020)
MAX.
Note: Dimensions in millimeters (inches).
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
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