CXA1616N Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

fabricante

CXA1616N

Sync Discriminator for CRT Displays

Sony Semiconductor 

Package Outline

Unit: mm

CXA1616N

24PIN SSOP(PLASTIC)

∗7.8 ± 0.1

24

13

A

+ 0.2

1.25 – 0.1

0.1

1

+ 0.1

0.22 – 0.05

0.13 M

12

0.65

+ 0.05

0.15 – 0.02

0.1 ± 0.1

NOTE: Dimensions “∗” does not include mold protrusion.

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-24P-L01

SSOP024-P-0056

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

PACKAGE MASS

0.1g

CXA1616S

22PIN SDIP (PLASTIC)

+ 0.4

19.2 – 0.1

22

12

1

11

1.778

0° to 15°

CXA1616N/S

0.5 ± 0.1

+ 0.15

0.9 – 0.1

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-22P-01

SDIP022-P-0300

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

PACKAGE MASS

COPPER ALLOY

0.95g

– 20 –

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