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HFA1245/883 Ver la hoja de datos (PDF) - Intersil

Número de pieza
componentes Descripción
fabricante
HFA1245/883 Datasheet PDF : 6 Pages
1 2 3 4 5 6
HFA1245/883
Die Characteristics
DIE DIMENSIONS:
69 x 92 x 19 mils ± 1 mils
1750 x 2330 x 483µm ± 25.4µm
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ± 0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ± 0.8kÅ
GLASSIVATION:
Type: Nitride
Thickness: 4kÅ ± 0.5kÅ
WORST CASE CURRENT DENSITY: TBD
TRANSISTOR COUNT: 150
SUBSTRATE POTENTIAL (Powered Up): Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1245/883
-IN1
OUT1 GND (NOTE 1)
V+
+IN1
NC
DISABLE1
V-
DISABLE2
NC
+IN2
OUT2
V-
VL
-IN2
V-
NOTE:
1. This is an optional GND pad. Users may set a GND reference, via this pad, to ensure the TTL compatibility of the DISABLE inputs when
using asymmetrical supplies (e.g. V+ = 10V, V- = 0V). See the “Application Information” section for details.
3-229
Spec Number 511112-883

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