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B32651A7682J(2009) Ver la hoja de datos (PDF) - EPCOS AG

Número de pieza
componentes Descripción
fabricante
B32651A7682J
(Rev.:2009)
Epcos
EPCOS AG 
B32651A7682J Datasheet PDF : 40 Pages
First Prev 31 32 33 34 35 36 37 38 39 40
B32651 ... B32656
High pulse (wound)
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 °C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Page 34 of 40

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