FSA2866UMX Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
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fabricante
FSA2866UMX Datasheet PDF : 3 Pages
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Physical Dimensions
0.10 C
2X
PIN1
IDENT
3.00
A
B
3.00
1.80
3.00
TOP VIEW
0.10 C
0.55 MAX
0.10 C
2X
0.08 C
(0.15)
3.00
1.80
0.80 20X
0.40
0.20 20X
RECOMMENDED LAND PATTERN
0.05
0.00
C
SEATING
PLANE
SIDE VIEW
1.75
1.65
6
10
5
1.75
1.65
1
11
0.25
0.15
20X
15
PIN 1
IDENT
20
0.40
16
0.45
0.35
20X
0.10 C A B
0.05 C
BOTTOM VIEW
NOTES:
A. PACKAGE CONFORMS TO JEDEC MO-248
VARIATION UEEE.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
FROM PCB MATRIX CALCULATOR V2009.
E. DRAWING FILENAME: MKT-UMLP20Brev1.
Figure 9. 20-Pin Ultrathin Molded Leadless Package (UMLP)
Order Number
FSA2866UMX
Operating
Temperature Range
-40 to 85°C
Package Description
20-Lead Ultrathin Molded Leadless Package (UMLP)
Packing
Method
Tape & Reel
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
8
www.fairchildsemi.com
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