ZXMN6A07Z
Electrical characteristics (at Tamb = 25°C unless otherwise stated)
Parameter
Symbol
Static
Drain-source breakdown
voltage
V(BR)DSS
Zero gate voltage drain current IDSS
Gate-body leakage
IGSS
Gate-source threshold voltage VGS(th)
Static drain-source on-state
resistance (*)
RDS(on)
Forward transconductance(*)(‡) gfs
Dynamic(‡)
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance Crss
Switching (†) (‡)
Turn-on-delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Total gate charge
Qg
Total gate charge
Qg
Gate-source charge
Qgs
Gate drain charge
Qgd
Source-drain diode
Diode forward voltage(*)
VSD
Reverse recovery time(‡)
trr
Reverse recovery charge(‡)
Qrr
Min.
60
1.0
Typ.
2.3
166
19.5
8.7
1.8
1.4
4.9
2.0
1.65
3.2
0.67
0.82
0.80
20.5
21.3
Max. Unit Conditions
V ID= 250A, VGS=0V
1
100
3.0
0.250
0.350
A VDS= 60V, VGS=0V
nA VGS=±20V, VDS=0V
V ID= 250A, VDS=VGS
⍀ VGS= 10V, ID= 1.8A
⍀ VGS= 4.5V, ID= 1.3A
S VDS= 15V, ID= 1.8A
pF VDS= 40V, VGS=0V
pF f=1MHz
pF
ns VDD= 30V, VGS= 10V
ns ID= 1.8A
ns RG ≈ 6.0⍀
ns
VDS= 30V, VGS= 5V
ID= 1.8A
nC VDS= 30V, VGS= 10V
nC ID= 1.8A
nC
0.95
V Tj=25°C, IS= 0.45A,
VGS=0V
ns Tj=25°C, IF= 1.8A,
nC di/dt=100A/s
NOTES:
(*) Measured under pulsed conditions. Pulse width Յ300s; duty cycle Յ2%.
(†) Switching characteristics are independent of operating junction temperature.
(‡) For design aid only, not subject to production testing.
Issue 8 - January 2007
4
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