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ZXMN10A09K Ver la hoja de datos (PDF) - Zetex => Diodes

Número de pieza
componentes Descripción
fabricante
ZXMN10A09K Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
ZXMN10A09K
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Drain-source voltage
Gate-source voltage
Continuous drain current @ VGS=10V; TA=25°C(b)
@ VGS=10V; TA=70°C(b)
@VGS=10V; TA=25°C (a)
Pulsed drain current (c)
Continuous source current (body diode) (b)
Pulsed source current (body diode) (c)
Power dissipation at TA =25°C (a)
Linear derating factor
Power dissipation at TA =25°C (b)
Linear derating factor
Power dissipation at TA =25°C (d)
Linear derating factor
Operating and storage temperature range
SYMBOL
VDSS
VGS
ID
IDM
IS
ISM
PD
PD
PD
Tj, Tstg
LIMIT
100
±20
7.7
6.2
5
27
11
27
4.3
34.4
10.1
80.8
2.15
17.2
-55 to +150
UNIT
V
V
A
A
A
A
A
A
W
mW/°C
W
mW/°C
W
mW/°C
°C
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
UNIT
Junction to ambient (a)
RJA
29
°C/W
Junction to ambient (b)
RJA
12.3
°C/W
Junction to ambient (d)
RJA
58
°C/W
NOTES
(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t Յ 10 sec.
(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300s - pulse width limited by maximum junction temperature.
(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
SEMICONDUCTORS
ISSUE 6 - JANUARY 2005
2

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