AD9501(RevB) Ver la hoja de datos (PDF) - Analog Devices

Número de pieza

componentes Descripción

fabricante

AD9501
(Rev.:RevB)

Digitally Programmable Delay Generator

Analog Devices 

AD9501

ABSOLUTE MAXIMUM RATINGS1

Positive Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V

Digital Input Voltage Range . . . . . . . . . . . . . . . –0.5 V to +VS

Trigger/Reset Input Voltage Range . . . . . . . . . . –0.5 V to +VS

Minimum RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 W

Digital Output Current (Sourcing) . . . . . . . . . . . . . . . 10 mA

Digital Output Current (Sinking) . . . . . . . . . . . . . . . . 50 mA

Operating Temperature Range

AD9501JN/JP . . . . . . . . . . . . . . . . . . . . . . . . . 0∞C to 70∞C

Storage Temperature Range . . . . . . . . . . . . –65∞C to +150∞C

Junction Temperature2 . . . . . . . . . . . . . . . . . . . . . . . . . 175∞C

Lead Soldering Temperature (10 sec) . . . . . . . . . . . . . . 300∞C

NOTES

1Absolute Maximum Ratings are limiting values, to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability

is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period of time may affect device reliability.

2Typical thermal impedances: 20-lead plastic leaded chip carrier, qJA = 73∞C/W; qJC = 29∞C/W. 20-lead plastic DIP, qJA = 65∞C/W; qJC = 26∞C/W.

OBSOLETE Device

Temperature

AD9501JN

AD9501JP

AD9501JP-REEL

0∞C to 70∞C

0∞C to 70∞C

0∞C to 70∞C

*N = Plastic DIP; P = Plastic Leaded Chip Carrier.

ORDERING GUIDE

Description

20-Lead Plastic DIP

20-Lead Plastic Leaded Chip Carrier

20-Lead Plastic Leaded Chip Carrier

Package Option*

N-20

P-20A

P-20A

EXPLANATION OF TEST LEVELS

Test Level

I. 100% production tested.

II. 100% production tested at 25∞C, and sample tested at specified temperatures.

III. Sample tested only.

IV. Parameter is guaranteed by design and characterization testing.

V. Parameter is a typical value only.

VI. All devices are 100% production tested at 25∞C. 100% production tested at temperature extremes for

extended temperature devices; sample tested at temperature extremes for commercial/industrial devices.

DIE LAYOUT AND MECHANICAL INFORMATION

MECHANICAL INFORMATION

Die Dimensions . . . . . . . . . . . . . . . . . . 89 ¥ 153 ¥ 15 (± 2) mils

Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 ¥ 4 mils

Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum

Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None

Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground

Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride

Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic

Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding

or 1 mil, Gold; Gold Ball Bonding

REV. B

–3–

Share Link: